this is information on a product in full production. december 2015 docid8621 rev 4 1/8 STPS15L60C power schottky rectifier datasheet - production data features ? very small conduction losses ? negligible switching losses ? low forward voltage drop ? avalanche specification ? ecopack ? 2 compliant component for dpak on demand description dual center tab schottky rectifier suited for switched mode power supply and high frequency dc to dc converters. packaged in dpak, this device is intended for use in low voltage, high frequency inverters, free- wheeling and polarity protection applications. $ $ ' 3 $ . . . $ $ . $ $ table 1. device summary symbol value i f(av) 2 x 7.5 a v rrm 60 v t j(max) 150 c v f (typ) 0.52 v www.st.com
characteristics STPS15L60C 2/8 docid8621 rev 4 1 characteristics when the diodes 1 and 2 are used simultaneously: ? t j (diode 1) = p(diode1) x r th(j-c) (per diode) + p(diode 2) x r th(c) to evaluate the conduction loss es use the following equation: p = 0.32 x i f(av) + 0.027 i f 2 (rms) table 2. absolute ratings (limiting values pe r diode at 25 c unless otherwise stated) symbol parameter value unit v rrm repetitive peak reverse voltage 60 v i f(rms) forward rms current 10 a i f(av) average forward current, = 0.5, square wave t c = 135 c (1) per diode 7.5 a per device 15 i fsm surge non repetitive forward current t p = 10 ms sinusoidal 75 a p arm repetitive peak avalanche power t p = 10 s, t j = 125 c 265 w t stg storage temperature range -65 to +175 c t j maximum operating junction temperature (2) 150 c 1. value based on r th(j-c) max (per diode) 2. condition to avoid thermal runaway for a diode on its own heatsink dptot dtj --------------- 1 rth j a ? ?? ------------------------- - ? table 3. thermal resistances symbol parameter value unit r th(j-c) junction to case per diode 4 c/w to ta l 2 . 4 r th(c) coupling 0.7 table 4. static electrical characteristics (per diode) symbol parameter test conditions min. typ. max. unit i r (1) reverse leakage current t j = 25 c v r = v rrm 200 a t j = 125 c 45 60 ma v f (1) forward voltage drop t j = 25 c i f = 7.5 a 0.62 v t j = 125 c 0.52 0.57 t j = 25 c i f = 12 a 0.76 t j = 125 c 0.62 0.68 t j = 25 c i f = 15 a 0.82 t j = 125 c 0.66 0.72 1. pulse test: t p = 380 s, ? < 2%
docid8621 rev 4 3/8 STPS15L60C characteristics 8 figure 1. average forward power dissipation versus average forward current (per diode) figure 2. average forward current versus ambient temperature ( = 0.5)(per diode) , ) $ 9 $ 3 ) $ 9 : 7 / w s 7 w s / / / / / 7 d p e ? & , ) $ 9 $ 5 w k m d 5 w k m f 5 w k m d ? & : figure 3. normalized avalanche power derating versus pulse duration at t j = 125 c figure 4. relative variation of thermal impedance junction to case versus pulse duration p(t p ) p (10 s) arm arm 0.001 0.01 0.1 1 1 10 100 1000 t (s) p = w k m f 5 w k m f ( ( ( ( w 3 v 6 l q j o h s x o v h / / / 7 / w s 7 w s
characteristics STPS15L60C 4/8 docid8621 rev 4 figure 5. reverse leakage current versus reverse voltage applied (typical values, per diode) figure 6. junction capacitance versus reverse voltage applied (typical values, per diode) ( ( ( ( ( ( ( 9 5 9 7 m ? & 7 m ? & , 5 p $ 7 m ? & 7 m ? & 7 m ? & 7 m ? & & s ) 9 5 9 ) 0 + ] 9 5 0 6 p 9 7 m ? & figure 7. forward voltage drop versus forward current (per diode) figure 8. thermal resistance junction to ambient versus copper surface under tab , ) $ 7 m ? & p d [ l p x p y d o x h v 9 ) 9 7 m ? & w \ s l f d o y d o x h v 7 m ? & p d [ l p x p y d o x h v 5 w k m d ? & : 6 & 8 f p e ' 3 $ . ( s r [ \ s u l q w h g e r d u g ) 5 f r s s h u w k l f n q h v v ? p
docid8621 rev 4 5/8 STPS15L60C package information 8 2 package information ? epoxy meets ul94,v0 ? cooling method: by conduction (c) in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions a nd product status are available at: www.st.com . ecopack ? is an st trademark. 2.1 dpak package information figure 9. dpak package outline note: this package drawing may s lightly differ from the physic al package. however, all the specified dimensions are guaranteed. / / $ 5 5 ' f $ f 9 $ + / h h e / ( e * d x j h s o d q h ' ( 7 k h u p d o s d g
package information STPS15L60C 6/8 docid8621 rev 4 figure 10. dpak footprint dimensions (in mm) table 5. dpak package mechanical data ref. dimensions millimeters inches min. typ. max. min. typ. max. a 2.18 2.40 0.085 0.094 a1 0.90 1.10 0.035 0.043 a2 0.03 0.23 0.001 0.009 b 0.64 0.90 0.025 0.035 b4 4.95 5.46 0.194 0.214 c 0.46 0.61 0.018 0.024 c2 0.46 0.60 0.018 0.023 d 5.97 6.22 0.235 0.244 d1 4.95 5.60 0.194 0.220 e 6.35 6.73 0.250 0.264 e1 4.32 5.50 0.170 0.216 e 2.28 0.090 e1 4.40 4.70 0.173 0.185 h 9.35 10.40 0.368 0.409 l 1.00 1.78 0.039 0.070 l2 1.27 0.050 l4 0.60 1.02 0.023 0.040 v2 -8 +8 -8 8 $ % 7 k h g h y l f h p x v w e h s r v l w l r q h g z l w k l q $ %
docid8621 rev 4 7/8 STPS15L60C ordering information 8 3 ordering information 4 revision history table 6. ordering information order code marking package weight base qty delivery mode STPS15L60Cb s15l60c dpak 0.32 g 75 tube STPS15L60Cb-tr s15l60c dpak 0.32 g 2500 tape and reel table 7. document revision history date revision description of changes 27-jun-2012 2 automatic revalidation date workflow started. 07-jan-2015 3 updated dpak package information and reformatted to current standard. 18-dec-2015 4 updated dpak package information and reformatted to current standard.
STPS15L60C 8/8 docid8621 rev 4 important notice ? please read carefully stmicroelectronics nv and its subsidiaries (?st?) reserve the right to make changes, corrections, enhancements, modifications, and improvements to st products and/or to this document at any time without notice. purchasers should obtain the latest relevant in formation on st products before placing orders. st products are sold pursuant to st?s terms and conditions of sale in place at the time of o rder acknowledgement. purchasers are solely responsible for the choice, selection, and use of st products and st assumes no liability for application assistance or the design of purchasers? products. no license, express or implied, to any intellectual property right is granted by st herein. resale of st products with provisions different from the information set forth herein shall void any warranty granted by st for such product. st and the st logo are trademarks of st. all other product or service names are the property of their respective owners. information in this document supersedes and replaces information previously supplied in any prior versions of this document. ? 2015 stmicroelectronics ? all rights reserved
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